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International Endeavors Corporation to Present at the AI & Technology Virtual Investor Conference October 28th

We, ModuLink Inc. (OTC: IDVV), are scheduled to participate in the AI & Technology Virtual Investor Conference hosted by VirtualInvestorConferences.com. CEO William Fu will deliver a live presentation and engage with investors during a Q&A session.


For the reference information:

October 28, 2025

Time: 9:00 AM ET

LINK: REGISTER HERE


Recent Highlights:

  • Acquired 100% of ModuLink Investment Limited

  • SEC approval of Form 10 registration

  • Corporate name change to ModuLink Inc.


ModuLink develops sustainable properties using modular integrated construction (MiC), atmospheric water generation (AWG), and IoT-based management systems.


For more details:

International Endeavors Corporation to Present at the AI & Technology Virtual Investor Conference October 28th | IDVV - International Endeavors Corp | News | OTC Markets



EV Chargers

ModuLink Corporation Limited
(An US OTC Listed Company)

 

Tel: 852-3188 2012

Email: info@modulinktech.com
UNIT NO. 602, 6/F., WESTIN CENTRE, NO. 26 HUNG TO ROAD, KWUN TONG, KOWLOON, HONG KONG 

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